Added to the directory: Wed, 28 Dec, 2005. Source: sudhian.
Quote:In addition to a new packaging process Presler brings a new
manufacturing process for Intel as well. The new 65nm manufacturing
process uses second generation strained silicon technology and has less
leakage compared to the existing 90nm Prescott and Smithfield. This
should theoretically allow Presler and Cedar Mill products to operate at
lower voltages, consume less power, and run cooler.
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